The total content of regulated impurities in lots of copper and copper powder (Li, Ve, Ti, V, Cr, Co, Rb, Mo, Pd, Cd, Pt, Au, Bi) is not more than 0.0001 ppm %. The list of impurities is set by the customer, according to the contract.
The purity of the batch is calculated as the difference between 100% and the total content of regulated impurities, and is 99.9999 ppm%.
✓ Copper is radiation-safe.
✓ Specific natural residual radioactivity is not more than 1.10-11 Ki/g.

An important characteristic of the material is the almost complete absence of oxygen and hydrogen in the metal.

PRODUCT CATALOGUE

Copper ingots (strip, bar)
high purity

High purity
ultrafine copper powder (UFP)

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Copper ingots (strip, bar) of high purity

С4Н7 – С5Н

High purity copper in the form of a strip (tire), oxygen-free copper in a hard or soft state. It was obtained by melting copper cathodes in an inert atmosphere.
Chemical purity: 99.997 – 99.9985%, in terms of impurities,
- by impurities Metals Basis, GOST, ASTM;
- according to TU 24.44.24-003-17804435-2024 "High purity copper ingots." Technical specifications" for impurities: Li, Be, Mg, Ti, V, Co, Mo, Cd, Au, Bi.
Isotopic composition: Cu63-69.09%; Cu65-30.91%.
Standard size:
✓ Strips: 10-25 mm x 100-200 mm; bar: 25-50 mm square
✓ length 1000 and 2000 mm
HS Code: 7409190000 "Plates, sheets, strips and tapes, of refined copper, with a thickness exceeding 0.15 mm, other".

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С6Н

High purity copper in the form of a strip (tire), oxygen-free copper in a hard or soft state. It is obtained by melting copper cathodes in an inert atmosphere or vacuum.
Chemical purity: 99.9999%, in terms of impurities,
- according to TU 24.44.24-003-17804435-2024 "High purity copper ingots." Technical specifications" for impurities: Li, Be, Mg, Ti, V, Co, Mo, Cd, Au, Bi.
Isotopic composition: Cu63-69.09%; Cu65-30.91%.
Standard size:
✓ Strips: 6-15 mm x 100 mm; Bar: square, circle 25-50 mm
✓ length 1000 and 2000 mm
HS Code: 7409190000 "Plates, sheets, strips and tapes, of refined copper, with a thickness exceeding 0.15 mm, other".

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С6Н

High purity copper in the form of a flat ingot (tile), oxygen-free copper. It was obtained by repeated electrolysis with final vacuum melting.
Chemical purity: more than 99.9999%, in terms of impurities,
- according to GOST 859-2014 "Copper. Stamps",
- according to TU 24.44.24-003-17804435-2024 "High purity copper ingots. Technical specifications" for impurities: Li, Be, Mg, Ti, V, Co, Mo, Cd, Au, Bi.
Isotopic composition: Cu63-69.09%; Cu65-30.91%.
Standard size:
✓ Ingots flat 20 mm; square 30x60x60mm; round diam. 70mm
✓ weighing 1+/-0.05 kg; 2.5 -3.0 kg
HS Code: 7409190000 "Plates, sheets, strips and tapes, of refined copper, with a thickness exceeding 0.15 mm, other".

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Copper powder ultrafine high purity

PMU, fraction of 50-70 microns

Ultrafine copper powder of high purity. It is obtained by evaporation and condensation of copper vapors in an inert gas medium.
Particle size: 50 - 70 microns
Chemical purity: 99.999-99.9995%, in terms of impurities,
- according to GOST 4960-2017 "Electrolytic copper powder. Tech. conditions";
- according to IGAS (Mg,Al,Ti,Fe,Ni,Zn,Mo,Cd,Sn);
- according to TU 24.44.21-002-17804435-2024 "High purity electrolytic copper powder. Tech. conditions", impurities: Li, Be, Ti, V, Cr, Co, Rb, Mo, Pd, Cd.
Isotopic composition: Cu63-69.09%; Cu65-30.91%.
Packaging: The powder is stabilized in argon medium, supplied in PET containers of 2 – 2.5 kg, in containers of 25-85 kg.
HS Code: 7406100000 "Non-cellular copper powders"

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PMU, fraction of 15-30 microns

Ultrafine copper powder of high purity. It is obtained by evaporation and condensation of copper vapors in an inert gas environment or vacuum.
Particle size: 15 - 30 microns
Chemical purity: 99.9999%, in terms of impurities,
- according to GOST 4960-2017 "Electrolytic copper powder. Tech. conditions";
- according to ISE (Li,Be,Ti,V,Cr,Co,Rb,Mo,Pd,Cd);
- according to TU 24.44.21-002-17804435-2024 "High purity electrolytic copper powder. Tech. conditions", impurities: Li, Be, Ti, V, Cr, Co, Rb, Mo, Pd, Cd.
Isotopic composition: Cu63-69.09%; Cu65-30.91%.
Packaging: The powder is stabilized in argon medium, supplied in PET or glass containers of 2 kg, glass ampoules of 0.25 kg, in containers of 25-85 kg.
HS Code: 7406100000 "Non-cellular copper powders"

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PMU, fraction of 8-12 microns

Ultrafine copper powder of high purity. It was obtained by electrolytic deposition from salt solutions using copper electrodes.
Particle size: 8 - 12 microns
Chemical purity: 99.9995 - 99.9999 %, in terms of impurities,
- according to GOST 4960-2017 "Electrolytic copper powder. Tech. conditions";
- according to IGAS (Mg,Al,Ti,Fe,Ni,Zn,Mo,Cd,Sn);
- according to TU 24.44.21-002-17804435-2024 "High purity electrolytic copper powder. Tech. conditions", impurities: Li, Be, Ti, V, Cr, Co, Rb, Mo, Pd, Cd.
Isotopic composition: Cu63-69.09%; Cu65-30.91%.
Packaging: The powder is stabilized in argon medium, supplied in PET or glass containers of 2 kg, glass ampoules of 0.25 kg, in containers of 25-85 kg.
HS Code: 7406100000 "Non-cellular copper powders"

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Sampling from each batch submitted by the customer for certification is carried out by a representative of the certification laboratory and is strictly accountable. All containers are labeled and sealed.
Analysis methods: Spark mass spectrometry on a mass spectrometer with JMS-01-BM2 according to the method "Mass spectral determination of impurities (MSOP) B 1.1.

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APPLICATION OF HIGH PURITY COPPER
AND ULTRAFINE COPPER POWDERS

APPLICATION OF HIGH PURITY COPPER AND ULTRAFINE
COPPER POWDERS

High-purity copper is widely used in various fields due to its high anti-corrosion properties both under normal conditions and in aggressive environments, although it is not resistant to ammonia and sulfur dioxide gases. It is easy to process by pressure and soldering, but difficult to cut and poorly welded.

In metallurgy, it is used for alloying metals, producing high-purity alloys, and creating protective and functional coatings.
In microelectronics, high-purity copper is used as a substitute for silver and gold in electrically conductive elements, for nanocoating, and for manufacturing high-precision electronic components.

In cryogenic technology, it is indispensable in ultra-low temperature conditions due to its stability.
In acoustic equipment, high-purity copper is used to produce wires used in high-end audio and video equipment.

In the general industry, it is used in heat exchange systems, for the manufacture of parts by pressing, in highly efficient components of batteries and fuel cells, in conductive inks and modern medical coatings, in 3D printing.

Thus, high-purity copper is a key material in metallurgy, microelectronics, acoustics, cryogenic engineering, aviation and space industries, paint and varnish, chemical, automotive and cosmetics industries, as well as in the production of solar panels and heat exchange systems.